ZENG Xiang-an, AI Bin, DENG Youjun, et al. Study on the Stability of the Silicon Wafers Passivated by Different Surface Passivation Processes[J]. Acta Scientiarum Naturalium Universitatis SunYatseni, 2014,53(3):14-19.
ZENG Xiang-an, AI Bin, DENG Youjun, et al. Study on the Stability of the Silicon Wafers Passivated by Different Surface Passivation Processes[J]. Acta Scientiarum Naturalium Universitatis SunYatseni, 2014,53(3):14-19.DOI:
The relationship of minority carrier lifetime of various silicon wafers with the time stored in dark condition was investigated by using WT2000 tester. The silicon wafers include the primary wafer
the chemical thinned wafer
the wafer passivated by thermal oxidation
the wafer passivated by SiN
x
:H film deposited by plasma enhanced chemical vapor deposition (PECVD) and the wafer passivated by iodine solution. Three types of silicon wafers are B-doped CZ-silicon
Bdoped Multicrystalline (MC) silicon
B-doped upgraded-metallurgical-grade(UMG) silicon. As the results from fifteen types of silicon wafer specimens in total were used. Then the stability of the different surface passivation processes was studied. Finally
it was found that the passivation effect of iodine passivation is better