With the help of the powder X-ray diffraction

scanning electron microscope and energy dispersive spectroscopy

the PSM and SSM were studied to develop the quantitative analyses and demonstrate the relationship between the phase transition of copper melted mark the external heat condition in electrical fire. It is found that it is different for the trend of the grain size with the heat treatment time between PSM and SSM

and the curves of the texture coefficient with the heat treatment temperature between PSM and SSM shows the respective  trend  obviously. The chemical composition

included mainly carbon

oxygen and copper. The ratios of oxygen for the PSM is about 6%

and the ratio of oxygen for the SSM is about 3% in deposition layer. The atomic ratio of oxygen has not changed very much basically in the melted mark substrate

and it is at around 3% both PSM and SSM. The external heat has a different influence on phase transition of PSM and SSM

and the microstructure could reveal clearly

therefore

it is possible to set up the quantitative analyses for short circuit melted mark.